50MP Sony IMX766 Face Recognition CMOS Image Sensor Camera Module
Product Description:
IMX766 is the latest high-end image sensor launched by Sony. It performs well in terms of imaging quality, image quality effects, performance in low-light environments and color saturation.
This sensor has the characteristics of high pixels, high dynamic range and high light utilization, and has strong photo quality performance capabilities. Its effective pixel count reaches 50 million pixels, allowing users to take photos without worrying about distortion or insufficient pixels.
At the same time, the image quality of IMX766 is also very good. It performs well in terms of color restoration, contrast performance and noise control, and can meet the needs of users in different shooting scenarios.
IMX766 also has strong low-light performance capabilities, which is also an important reason why it is favored by users. When shooting night scenes, the sensor can effectively capture light, making the images captured in the photos clearer and brighter.
Features:
Back-illuminated and stacked CMOS image sensor ◆ Quad Bayer Coding (QBC) color filter arrangement ◆ Phase Detection Auto Focus (PDAF) with 2x2OCL ◆ High Frame Rate 24frame/s@Full resolution (QBC Re-mosaic) 120frame/s@2x2 Adjacent Pixel Binning (16:9) 480frame/s@2x2 Adjacent Pixel Binning V2H2(16:9) ◆ High signal to noise ratio (SNR) ◆ Dual sensor synchronization operation ◆ Built-in 2D Dynamic Defect Pixel Correction (DPC) ◆ Lens Shading Correction (LSC) ◆ Built-in temperature sensor ◆ Output video format of RAW10, RAW8 ◆ QBC Re-mosaic function ◆ Two PLLs for independent clock generation for pixel control and data output interface ◆ CSI-2 serial data output MIPI C-PHY 1trio/2trio/3trio, Max 3.1 Gsps/Trio, C-PHY spec. ver. 1.2 compliant MIPI D-PHY 2lane/4lane, Max. 2.5Gbps/lane, D-PHY spec. ver. 1.2 compliant ◆ 2-wire serial communication (Supports I2C "Fast mode" and "Fast-mode Plus", I3C) ◆ DOL function (Quad Binning and 10bit mode only) Back-illuminated and stacked CMOS image sensor ◆ Quad Bayer Coding (QBC) color filter arrangement ◆ Phase Detection Auto Focus (PDAF) with 2x2OCL ◆ High Frame Rate 24frame/s@Full resolution (QBC Re-mosaic) 120frame/s@2x2 Adjacent Pixel Binning (16:9) 480frame/s@2x2 Adjacent Pixel Binning V2H2(16:9) ◆ High signal to noise ratio (SNR) ◆ Dual sensor synchronization operation ◆ Built-in 2D Dynamic Defect Pixel Correction (DPC) ◆ Lens Shading Correction (LSC) ◆ Built-in temperature sensor ◆ Output video format of RAW10, RAW8 ◆ QBC Re-mosaic function ◆ Two PLLs for independent clock generation for pixel control and data output interface ◆ CSI-2 serial data output MIPI C-PHY 1trio/2trio/3trio, Max 3.1 Gsps/Trio, C-PHY spec. ver. 1.2 compliant MIPI D-PHY 2lane/4lane, Max. 2.5Gbps/lane, D-PHY spec. ver. 1.2 compliant ◆ 2-wire serial communication (Supports I2C "Fast mode" and "Fast-mode Plus", I3C) ◆ DOL function (Quad Binning and 10bit mode only) Back-illuminated and stacked CMOS image sensor ◆ Quad Bayer Coding (QBC) color filter arrangement ◆ Phase Detection Auto Focus (PDAF) with 2x2OCL ◆ High Frame Rate 24frame/s@Full resolution (QBC Re-mosaic) 120frame/s@2x2 Adjacent Pixel Binning (16:9) 480frame/s@2x2 Adjacent Pixel Binning V2H2(16:9) ◆ High signal to noise ratio (SNR) ◆ Dual sensor synchronization operation ◆ Built-in 2D Dynamic Defect Pixel Correction (DPC) ◆ Lens Shading Correction (LSC) ◆ Built-in temperature sensor ◆ Output video format of RAW10, RAW8 ◆ QBC Re-mosaic function ◆ Two PLLs for independent clock generation for pixel control and data output interface ◆ CSI-2 serial data output MIPI C-PHY 1trio/2trio/3trio, Max 3.1 Gsps/Trio, C-PHY spec. ver. 1.2 compliant MIPI D-PHY 2lane/4lane, Max. 2.5Gbps/lane, D-PHY spec. ver. 1.2 compliant ◆ 2-wire serial communication (Supports I2C "Fast mode" and "Fast-mode Plus", I3C) ◆ DOL function (Quad Binning and 10bit mode only) Back-illuminated and stacked CMOS image sensor ◆ Quad Bayer Coding (QBC) color filter arrangement ◆ Phase Detection Auto Focus (PDAF) with 2x2OCL ◆ High Frame Rate 24frame/s@Full resolution (QBC Re-mosaic) 120frame/s@2x2 Adjacent Pixel Binning (16:9) 480frame/s@2x2 Adjacent Pixel Binning V2H2(16:9) ◆ High signal to noise ratio (SNR) ◆ Dual sensor synchronization operation ◆ Built-in 2D Dynamic Defect Pixel Correction (DPC) ◆ Lens Shading Correction (LSC) ◆ Built-in temperature sensor ◆ Output video format of RAW10, RAW8 ◆ QBC Re-mosaic function ◆ Two PLLs for independent clock generation for pixel control and data output interface ◆ CSI-2 serial data output MIPI C-PHY 1trio/2trio/3trio, Max 3.1 Gsps/Trio, C-PHY spec. ver. 1.2 compliant MIPI D-PHY 2lane/4lane, Max. 2.5Gbps/lane, D-PHY spec. ver. 1.2 compliant ◆ 2-wire serial communication (Supports I2C "Fast mode" and "Fast-mode Plus", I3C) ◆ DOL function (Quad Binning and 10bit mode only) ·Back-illuminated and stacked CMOS image sensor
·Quad Bayer Coding (QBC) color filter arrangement
·Phase Detection Auto Focus (PDAF) with 2x20CL
·High Frame Rate
24frame/s@Full resolution (QBC Re-mosaic)
120frame/s@2x2 Adjacent Pixel Binning (16:9)
480frame/s@2x2 Adjacent Pixel Binning V2H2(16:9)
·High signal to noise ratio (SNR)
·Dual sensor synchronization operation
·Built-in 2D Dynamic Defect Pixel Correction(DPC)
·Lens Shading Correction (LSC)
·Built-in temperature sensor
·Output video format of RAW10,RAW8
·QBC Re-mosaic function
·Two PLLs for independent clock generation for pixel control and data output interface
·CSI-2 serial data output
MIPI C-PHY 1trio/2trio/3trio, Max 3.1 Gsps/Trio,C-PHY spec. ver. 1.2 compliant
MIPI D-PHY 2lane/4lane, Max. 2.5Gbps/lane, D-PHY spec. ver.1.2 compliant
·2-wire serial communication (Supports IPC "Fast mode" and "Fast-mode Plus", I3C)
·DOLfunction (Quad Binning and 10bit mode only)
·4K bit of OTP ROM for users
Technical Parameters:
| Product Name | CMOS Camera Module |
| Certificate | CE, FCC, ISO, REACH |
| EFL | 5.59mm |
| Features | Wide Angle, High Pixels |
| DVDD | 1.05V |
| Sensor Type | IMX766 |
| Array Size | 50MP(12000*9000) |
| DOVDD | 1.8V |
| Pinout | 30pin |
| AVDD | 2.8V |
| F.NO | 1.88mm |
Customized Service:
We can customize FPC length, module shape, module head size, lens holder, imaging direction, pinout, connector, VCM, lens, firmware, etc.
Customized Process:
1. You can provide drawings or samples, as well as request documentation and developed by
our engineering staff.
2. Communication or Meeting
3. We will communicate with you in detail to determine somewhat product you need and try to set the most suitable product for you
according to your needs.
4. Sample Development
5. Determine the details of the development sample and the delivery time. Communicate at any time to ensure smooth progress.
6. Sample Testing
7. Test and age on your application, feedback test results, no need to modify, mass production.
Why Choose us:
Applications:
Automotive
Internet of Things (IoT)
Healthcare
About US:
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